工業和商業黃頁資訊網論文書籍站
Metal forming的問題，透過圖書和論文來找解法和答案更準確安心。 我們找到下列問答集和資訊懶人包
Metal forming的問題，我們搜遍了碩博士論文和台灣出版的書籍，推薦Klocke, Fritz寫的 Modeling And Computer Aided Planning of Manufacturing Processes 和Wu, Xin的 Microstructure-Based Analysis of Deformation Processes都 可以從中找到所需的評價。
另外網站Metal Forming - SAE International也說明：A thorough survey of metal forming processes and metal forming mechanics will be performed, including bulk deformation, sheet-metal, and powder metallurgy ...
這兩本書分別來自 和所出版 。
國立陽明交通大學 電信工程研究所 黃瑞彬所指導 鍾尚儒的 在CMOS IC製程上設計雙頻波束成形電路 （2021），提出Metal forming關鍵因素是什麼，來自於雙頻波束形成電路、環形耦合器。
而第二篇論文國立陽明交通大學 電子物理系所 趙天生所指導 陳威諺的 應力對於側壁鑲嵌式閘極全環繞多晶矽電晶體結晶性及可靠度之影響 （2021），提出因為有 多晶矽、應力、閘極全環繞電晶體、結晶性、可靠度的重點而找出了 Metal forming的解答。
最後網站Sheet Metal Forming -VNO - Vietnam Outsourcing則補充：Curling is a forming process that involves de-burring sheet metal to produce smooth edges. Sheet metal forming: Bending. Another common sheet metal forming ...
Modeling And Computer Aided Planning of Manufacturing Processes
為了解決Metal forming 的問題，作者Klocke, Fritz 這樣論述：
Modeling and planning of manufacturing processes provides the reader with detailed information about the different kinds of numerical modeling methods for the manufacturing processes forming, cutting and grinding, integrated in technology planning and design of process chains. Basic approaches in
modeling are presented. The orientation towards industrial applications for many kinds of modeling methods was evaluated. Empirical, analytical and numerical models are introduced. Finite Element Methods (FEM) are widely applied in the design of new manufacturing tools, their application is describ
ed and numerous application examples of FEM are presented. The method is a valuable device for the process planner for the design and the analysis of the metal forming process. Even complex forming processes can be analysed by means of the FEM. The interested reader receives profound information for
the modeling approaches in forming, cutting, grinding, and the integration of these tools into complex technology planning systems.
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在CMOS IC製程上設計雙頻波束成形電路
為了解決Metal forming 的問題，作者鍾尚儒 這樣論述：
在本論文使用CMOS IC製成，利用lump元件來代替原本使用傳輸線做成的Rat race耦合器。把四分之一波長和四分之三波長傳輸線轉換成T model 與π model，這兩個model皆為MIM電容和八邊形螺旋電感所組成，以lump方式來達到縮小體積的目的。而八邊形螺旋電感額外加上了pattern ground shield結構，能滿足製成對每層金屬的密度要求，也能減少電感與基板之間的損耗。在此做了X-Band、Ka-Band、Dual-Band三種型式，在單頻除了用一般的Lump電路還用了GA演算法和Broad-Band，而雙頻帶用了帶通與帶止的電路，比較各個電路的頻寬。這結構可用在m
ono pulse antenna system上面，天線接收到訊號，經過環形耦合器，輸出sum與delta訊號，再交給DAQ(data acquisition)做處理，找出目標。
Microstructure-Based Analysis of Deformation Processes
為了解決Metal forming 的問題，作者Wu, Xin 這樣論述：
Dr. Xin Wu is an Associate Professor in the Department of Mechanical Engineering at Wayne State University. His research interests include materials processing and manufacturing, deformation, plasticity, formability and performance at room and elevated temperatures, stamping and superplastic forming
. He teaches a number of manufacturing courses at the university, including an undergraduate course of Manufacturing Processes (ME3450), and graduate courses of Metal Cutting (ME6450), Metal Forming (ME7451), Computer Simulation in Metal Forming (ME7995), Laser Application in Materials Processing (M
E7452), Automotive Assembly Processes and System (ME7453), and Computer simulation of micromanufacturing (ME7680).
應力對於側壁鑲嵌式閘極全環繞多晶矽電晶體結晶性及可靠度之影響
為了解決Metal forming 的問題，作者陳威諺 這樣論述：
多晶矽因為其易堆疊性與低製程熱預算而被視為未來有機會實現三維晶片的材料，然而，多晶矽因結晶性較差而有較低的載子遷移率，進而影響其電性表現。為了使多晶矽元件能達到三維晶片電性需求，提升多晶矽結晶性成為實現三維晶片的重要的課題。在本篇論文中，我們成功製作出側壁鑲嵌式閘極全環繞多晶矽電晶體，並利用改變上層氮化矽厚度施加更大的應力於通道，藉此製作出結晶性更佳的電晶體。我們製作出上層氮化矽為 40 奈米、60 奈米及 80 奈米的多晶矽電晶體，並透過材料分析與電性比較來研究應力與結晶性的關係。研究發現，上層氮化物為 60 奈米之元件因其在結晶時感受到最大的應力，所以結晶速度最慢，最慢的結晶速度能成長出
最大的晶粒與最少的結晶缺陷。透過材料分析與電性量測，我們證實了上層氮化物為 60 奈米之元件有最好的結晶性與電性。此外，我們對不同上層氮化物厚度的側壁鑲嵌式閘極全環繞多晶矽電晶體的溫度穩定性、閘極偏壓可靠度與熱載子可靠度做了深入的研究。上層氮化物為 60 奈米之元件因其結晶性較佳所以有較好的通道與閘極氧化層介面，因此在高溫時有較少的次臨界擺幅衰退；也因其有較佳的結晶性與較少的晶界，晶界導致的電場加強效應較不明顯，因此展現出較佳的閘極偏壓可靠度與熱載子可靠度。此外，因為熱載子造成的碰撞解離相比於閘極偏壓時的主要衰退機制-氧化層電荷捕獲有更低的活化能，因此熱載子可靠度對結晶性有更高的敏感度。總結來
說，調變應力能大幅提升元件電性與可靠度，適合應用於未來三維晶片製程。