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微電子封裝銅導線架表面氧化層整合分析研究

為了解決c7025銅合金的問題，作者沈柏諺 這樣論述：

Copper is the most commonly used conductor and metallization material. However, copper surface readily gets oxidizedduring fabrication and assembly processes, and thereby causes degradation in electrical conductance and even reliability problems. This study develops an efficient and precise scheme

for detecting oxidized layer of Cu-Fe-Zn-P (C194) and Cu-Ni-Si-Mg (C7025) lead frames by means of electrochemical and optical analyses.Pre-treatments including micro-etching or electroplating are adopted to roughen the surface. Isothermal heating which simulates molding and curing processes is carr

ied out to oxidize lead frame surface. According to the absorption peaks of FTIR (Fourier transform infrared spectroscopy) spectra, the topmost surface of the oxide layer can be easily identified. In combination with the reduction potential and reduction time obtained from the coulometric reductio

n test, the variation of oxide phases along the through-thickness direction can also be revealed. Experimental results show that in addition to surface roughness, surface oxides and their structures play a more important role. In the case of the surface with one single Cu2O layer, an increase in o

xide layer results in a reduced bonding strength between lead frames and EMC. Once the topmost surface forms CuO, the shear strength could be enhanced. A single CuO layer may contribute to a higher bonding strength. Compared with electroplated C194, the better performance in joint strength and th

inner surface oxide layer for electroplated C7025 can be ascribed to the immersion Ag surface treatment.

電漿清洗製程對積體電路封裝之可靠度影響及改善

為了解決c7025銅合金的問題，作者詹鈞為 這樣論述：

本文研究以銅鎳矽合金(C7025)導線架之裸露晶粒座薄塑料方形扁平封裝(E-Pad Thin Quad Flat Package, E-TQFP)產品為例，藉由氫氣與氧氣電漿清洗後，讓導線架表面產生氫氧離子來提升金屬與環氧樹脂之間的結合，並透過試樣實驗來驗證此複合材料之結合性，並依據規範半導體產業之相關規格標準之聯合電子工業設備電子工業委員會(Joint Electronic Device Engineer Council, JEDEC)，進行預處理測試及可靠度測試之標準檢驗項目，再經由超音波掃描顯微鏡(Scanning Acoustic Tomography, SAT)掃描樣品的結果作為本

文原理論述證明。試驗成果顯示氫氣與氧氣之電漿清洗製程用於導線架上，隨著清洗時間增長，能有效提升封裝製程中之環氧樹脂與導線架兩者介面的結合力，並確認電漿清洗功能是具有時效性的。