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國立高雄科技大學 模具工程系 張致遠所指導 吳德育的 IC導線架黏貼耐熱膠材的沖切製程研究 （2019），提出C7025關鍵因素是什麼，來自於田口方法。
而第二篇論文國立中興大學 材料科學與工程學系所 宋振銘所指導 沈柏諺的 微電子封裝銅導線架表面氧化層整合分析研究 （2018），提出因為有 陰極還原法、氧化銅、導線架的重點而找出了 C7025的解答。
C7025進入發燒排行的影片
IC導線架黏貼耐熱膠材的沖切製程研究
為了解決C7025 的問題，作者吳德育 這樣論述：
本論文主要探討導線架在不同的沖切製程條件用於耐熱貼材時所生成的貼帶膠塊。針對本研究減少貼帶膠塊生成造成品質異常，將利用田口方法設計(L934)直交表，在不改變產品主要形式下找出四種可能因子，分別為A：沖頭外徑、Ｂ：壓料板單邊間隙、Ｃ：貼帶模具單邊間隙、Ｄ：熱板溫度，利用以上因子進行9種實驗組合進行分析。最後將實驗數據結合訊號雜訊比的望小特性公式，從中計算分析每組實驗因子的S/N比值，從中找尋各控制因子之最佳參數組合條件並進行實驗驗證，再利用ANOVA確認實驗的可靠性從F數值與Q數值之驗證得知驗證結果，進而得到每組實驗因子之最佳參數組合在與常用參數進行實驗分析，最終實驗結果得知最佳化參數組合為
A２ (沖頭外徑：0.002mm)、B2 ( 壓料板單邊間隙：0.003mm )、C３(模具單邊間隙：0.006mm)及D１(熱板溫度：130℃)，並經由100次的沖切當作實驗依據，最佳化參數相比常用參數來的S/N值提升0.75db、分數減少0.11。
微電子封裝銅導線架表面氧化層整合分析研究
為了解決C7025 的問題，作者沈柏諺 這樣論述：
Copper is the most commonly used conductor and metallization material. However, copper surface readily gets oxidizedduring fabrication and assembly processes, and thereby causes degradation in electrical conductance and even reliability problems. This study develops an efficient and precise scheme
for detecting oxidized layer of Cu-Fe-Zn-P (C194) and Cu-Ni-Si-Mg (C7025) lead frames by means of electrochemical and optical analyses.Pre-treatments including micro-etching or electroplating are adopted to roughen the surface. Isothermal heating which simulates molding and curing processes is carr
ied out to oxidize lead frame surface. According to the absorption peaks of FTIR (Fourier transform infrared spectroscopy) spectra, the topmost surface of the oxide layer can be easily identified. In combination with the reduction potential and reduction time obtained from the coulometric reductio
n test, the variation of oxide phases along the through-thickness direction can also be revealed. Experimental results show that in addition to surface roughness, surface oxides and their structures play a more important role. In the case of the surface with one single Cu2O layer, an increase in o
xide layer results in a reduced bonding strength between lead frames and EMC. Once the topmost surface forms CuO, the shear strength could be enhanced. A single CuO layer may contribute to a higher bonding strength. Compared with electroplated C194, the better performance in joint strength and th
inner surface oxide layer for electroplated C7025 can be ascribed to the immersion Ag surface treatment.